Ring PCB (Multilayer Printed Circuit Board) - Customizable High-Performance Solution

Core Product Features:

• Base Material & Compliance: Fabricated with FR4 TG150 substrate, this PCB is halogen-free—combining environmental friendliness with excellent mechanical strength and electrical insulation properties.
• Copper Thickness Configuration: Equipped with 5oz copper for inner layers and 2oz copper for outer layers, it boasts enhanced current-carrying capacity to support high-power application requirements.
• Precision Signal Performance: Features professional impedance (resistance) control, ensuring consistent signal integrity—critical for high-frequency, high-speed circuit operations.
• Surface Finishing: Adopts OSP (Organic Solderability Preservatives) finishing, which provides superior solderability, corrosion resistance, and long-term reliability for subsequent assembly processes.

Custom Multilayer Printed Circuit Board & Multilayer PCB Manufacturing

At Ring PCB, we specialize in custom multilayer printed circuit board solutions and advanced multilayer PCB manufacturing. With 17 years of industry experience, we provide professional PCB fabrication, assembly, and turnkey PCBA services trusted by clients worldwide.

We operate two modern facilities in Shenzhen and Zhuhai, covering 5,000㎡ with over 500 skilled employees. All products meet strict international certifications including ISO9001, ISO14001, ISO13485, and IATF16949. From rapid prototyping in 3 days to mass production within 7 days, we ensure high efficiency, precision, and consistent quality.

Serving Diverse Industries with Multilayer PCBs

Our multilayer PCBs are widely applied across:

• Automotive electronics – ADAS, EV power systems, lighting, and infotainment

• Medical devices – Imaging systems, monitoring equipment, wearable health electronics

• Telecommunication & Networking – 5G base stations, routers, high-frequency boards

• Consumer Electronics – Smartphones, IoT devices, smart home products

• Industrial Control – Automation, robotics, instrumentation, and power supplies

• Aerospace & Defense – High-reliability PCBs for radar, navigation, and communication systems

With expertise in different industries, we deliver tailored multilayer PCB solutions that meet stringent performance and reliability demands.

Overcoming Technical Challenges at Ring PCB

Through years of innovation, Ring PCB has successfully solved critical technical challenges in multilayer PCB manufacturing, such as:

• High-density interconnect (HDI) fabrication with laser drilling down to 0.1mm

• Impedance control for high-frequency and high-speed signal integrity

• Thermal management for high-power and LED metal-core PCBs

• Rigid-flex integration for lightweight, space-saving designs

• Fine-pitch BGA and microvia plating to support advanced IC packaging

• Low-loss materials for RF and microwave PCB applications

These capabilities enable us to produce reliable, high-performance custom multilayer printed circuit boards even for complex and demanding projects.

Technical Capabilities & Parameters

Your Trusted PCB Manufacturing Partner

With over 17 years of expertise, Ring PCB ensures that every custom multilayer PCB and multilayer printed circuit board is built to the highest standards. From OEM & EMS services to full-turnkey PCBA solutions, we provide a complete supply chain that helps you reduce costs, accelerate time-to-market, and guarantee reliability.

Contact us today at info@ringpcb.com or visit https://www.turnkeypcb-assembly.com.